Huawei unveils new chip technology law to deal with US sanctions

The announcement took place during a symposium held in Shanghai (China), when the company shared details of the “Tau Scale Law” and “LogicFolding”. The first refers to the new principle to guide the development of the industry, while the second is the architecture that improves transistor density.

How does Huawei want to revolutionize chip design?

Highlighting that the constant miniaturization of transistors is reaching its physical limit, the company decided to bet on improvements in data transfer speed and reduction of latency between components. This is where the Tau Scaling Law comes into play.

• The principle adapts to “Moore’s Law”, a standard adopted by the industry five decades ago and which focuses on miniaturization;
• Based on the new concept, the company developed LogicFolding technology, which enables rearrange internal circuits to reduce distances and optimize overall performance;
• In general, the proposal is to move from traditional node-driven scalability to system-level scalability, according to Omdia’s research director, He Hui;
• The technique appears as an alternative for Chinese semiconductor manufacturers to deal with lack of access to chip production toolsdue to American restrictions.

According to the director of Huawei’s Semiconductor Business Department, He Tingbo, the company mass-produced a total of 381 chips based on the concept over the past six years. They were used by different industries, sectors and markets.

“With the Tau Scaling Law, we hope to work closely with scientists, engineers and industry partners around the world to boost the sustainable development of the semiconductor and electronics industries”, said the executive, during the event.

First chips in 2026

The first commercial versions of processors manufactured with the new architecture developed by Huawei should be available by the end of the year. According to the company, the new Kirin chips will have “considerably” improved performance.

The first semiconductors with transistor density equivalent to 1.4 nm processes are scheduled to debut by 2031, in premium smartphones. The Chinese giant highlights that the Ascend chips, focused on AI and data centers, will also receive the technology.

Discounted Huawei products

Last month, DeepSeek introduced a new AI model that supports Huawei’s processors, paving the way to reduce external dependency. Find out more details in this matter.