CPUs are quickly becoming the main consumers of advanced packaging technologies. After all, demand has grown in proportion to the advancement of Agentic Artificial Intelligence.
And, if 2026 is already a year of ups and downs for the technology segment, 2027 promises to be equally intense (or even more so).
Next year, the main companies will launch new products or increase the production volume of existing ones. All this as AI continues to demand computational power.
To make things more exciting, a report from Morgan Stanley predicts that AMD’s EPYC Venice CPUs should reach 6.75 million units sold next year17% more than NVIDIA’s Vera (and 5.4 times the volume compared to 2026).
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Good news (from NVIDIA)
According to the information, NVIDIA will continue to be TSMC’s main customer for CoWoS packaging capabilities. And the Taiwanese company is expected to reach a capacity of 200,000 wafers per month in 2027.
The green team uses TSMC’s CoWoS packaging solution for two main products: CoWoS-L for AI GPUs such as Blackwell and Rubin, and CoWoS-R for Vera CPUs.
CoWoS-L production capacity is expected to reach around 910,000 units, an increase of 40% compared to the previous year, and Vera shipments are expected to double. And this would lead NVIDIA to generate 52% more revenue compared to the previous year.
Lastly, the report projected that NVIDIA’s Vera CPUs should reach 5.75 million units by 2027. This is an impressive number for the launch of a new CPU, and NVIDIA has already declared its intention to become the largest CPU supplier by 2026.
Great news (for AMD)
The central issue is that, at this moment, NVIDIA faces strong competition. And although its Vera processors are already in large-scale production at TSMC, so does AMD’s next-generation EPYC platform, codenamed Venice.
Remembering that Venice is based on the future Zen 6 architecture, which should offer significant gains in performance and efficiency.
As already highlighted, the report predicts that EPYC Venice CPUs will reach 6.75 million units, 17% more than NVIDIA’s Vera (and 5.4 times the volume compared to 2026).
AMD also uses an advanced 2nm manufacturing process from TSMC, while Vera is based on a 3nm process technology. And Vera is designed for Agentic AI, while AMD EPYC Venice addresses both AI and HPC.
Opera summary
The challenge ahead is not AMD versus NVIDIA or NVIDIA versus AMD, but rather custom silicon. Because many AI companies are now venturing into the field of custom silicon.
Just this week we reported that Google and MediaTek are working on a chip that combines CPU and AI in the same package for the next generation of intelligent agents. And OpenAI and Amazon are also in negotiations or already producing custom chips, which will intensify the debate between internal and external development.
That is, with the growing popularity of custom chip manufacturing, NVIDIA, AMD and other manufacturers may be facing a critical situation. Demand for computing power is still high, but AI companies producing their own chips will further exacerbate the discrepancy between supply and demand.
Source: Morgan Stanley.
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Source: www.adrenaline.com.br
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